cam的中文意思是? 制造企业常用到的英文缩写释义

1. 5M﹕Man(人) Machine(机器) Material(材料) Method(方法) Measurement(测量)

2. 5W1H﹕When(何时) Where(何地) Who(何人) What(何事) Why(为何) How(如何)

3. ACC﹕Accept(允收)

4. AQL: Acceptable Quality Level(允收品质水准)

5. ASAP: As Soon As Possible(尽快)

6.AQQ﹕Average Outgoing Quality(平均出厂品质)

8. BOM﹕Bill Of Material(物料清单)

9. BTO﹕Build To Order(按单生产)

10. C/T﹕Cycle Time(制程周期)

11. CAD﹕Computer Aided Design(计算机辅助设计)

12. CAE﹕Computer Aided Engineering(计算机辅助工程)

13. CAM﹕Computer Aided Manufacturing(计算机辅助制造)

14. CAR﹕Correction Active Report(改善行动报告)

15. DDP﹕Delivery Duty Paid(卖方负担运费及关税)

16. STS﹕Ship To Stock(免检入库)

17. DQA﹕Design Quality Assurance(设计品质保证)

18. DR﹕Design Review(设计审查)

19. ECN﹕Engineering Change Notice(工程变更通知)

20. ECR﹕Engineering Change Request(工程变更需求)

21.ETA﹕Estimate date of Arrive(预估到货日)

22. ETD﹕Estimate date of Department(预估出货日)

23. FAE﹕Field Application Engineer(应用工程师)

24. FAIR﹕First Article Inspection Report(初件检验报告)

25. FEA﹕Finite Elements Analysis(有限元素分析)

26. FIFO﹕First In & First Out(先进先出)

27. FMEA﹕Failure Mode Effects Analysis(失效模式分析)

28. FOB﹕Free On Board(离岸价格)

29. FQC﹕Final Quality Control(最终品质管制)

30. GQIS﹕Global Quality Information system(全球品质信息系统)

31. IE﹕Industry Engineer(工业工程)

32. IC﹕Integrated Circuit(集成电路)

33. IPQC﹕In Process Quality Control(制程品质管制)

34. IQC﹕Incoming Quality Control(进料品质管制)

35. IR﹕Infra Red(红外线)

36. ISO﹕International standardization Organization(国际标准组织)

37. IT﹕Information Technology(信息技朮)

38. JIS﹕Japanese Industrial Standard(日本工业标准)

39. JIT﹕Just In Time(及时)

40. L/T: Lead time(前置时间)

41. LLCR﹕Low Level Contact Resistance(低功率接触阻抗)

42. LQA﹕Laboratories Quality Assurance(试验室品质保证)

43. MAJ﹕Major Defect(主要缺点)

44. MFP﹕Multi Function Product(多功能产品)

45. OEM﹕Original Equipment Manufacture(原始设备制造)

46. ODM﹕Optimized Distribution Model(最佳配置模型)

47. MIN﹕Minor Defect(次要缺点)

48. MQA﹕Manufacture Quality Assurance(制造品质保证)

49. MRB﹕Material Review Board(来料不良及时处理团队)

50. MRP﹕Material Require Planning(物料需求计划)

或Manufacturing Resource Planning(制造资源规划)

51. P/N﹕Part Number(料号)

52. PCB﹕Printed circuit Board(印刷电路板)

53. PDCA﹕Plan(计划) Do(执行) Check(检讨) Action(改善)（戴明循环）

54. PDM﹕Product Data Management(产品数据管理)

55. PDT﹕Product Design Team(产品设计团队)

56. PM﹕Product Marketing(产品市场)或Project Management(项目管理)

57. PMP﹕Process Manufacture Plan(产品制程计划)

58. PMT﹕Product Management Team(产品经营团队)

59. PO Balance﹕Purchase Order Balance(先有未销(交)订单明细)

60. PPM﹕Parts Per Million(百万分之几)

61. QTY﹕Quantity(数量)

62. QA﹕Quality Assurance(品质保证)

63. QAN﹕Quality Action Notice(品质改善行动通知)

64. QCC﹕Quality Control Circle(品质)

65. QE﹕Quality Engineer(品质工程)

66. QIT﹕Quality Improvement Team(品质改善小组)

67. R&D﹕Research And Development(研究与发展﹕研究)

68. REJ﹕Reject(拒收)

69. REV﹕Revision(修订﹑版次)

70. REI﹕Radio Frequency Interference(射频干扰)

71. RFQ﹕Request For Quotation(询价需求)

72. RMS﹕Root Mean Square(均方根(有效值))

73. S/T﹕Standard Time(标准时间)

74. SMT﹕Surface Mounting Technology(表面粘着技朮)

75. SCR﹕Supplier Change Request(供货商变更需求)

76. SOP﹕Standard Operation Procedure(标准作业规范)

77. SPC﹕Statistical Process Control(统计制程管制)

78. SPEC﹕Specification(规格)

79. SSQA﹕Standard Supplier Quality Assessment(标准供货商品质评监)

80. TIP﹕Tip Innovation Plan(提案改善计划)

81. TPM﹕Total Production Maintenance(全面生产保养)

82. TQA﹕Total Quality Assurance(全面品质保证)

83. TQC﹕Total Quality Control(全面品质管制)

84. TQM﹕Total Quality Management(全面品质管理)

85. UL﹕Underwriters Laboratories Inc(美国安全协会试验室)

86. VDCS﹕Vendor Defect Correction Sheet(厂商进料异常通知单)

87. VQA﹕Vendor Quality Assurance(供货商品质保证)

88. VRB﹕Variance Review Board(制程异常及时处理团队)

89. WDR﹕Weekly Delivery Requirement(周出货需求)

90. ZD﹕Zero Defect(零缺点)

91. SCM﹕Supply Chain Management(供应链管理系统)